QPRC 2016

Mechanics based Reliability Assessment of Intel Packages

Shubhada Sahasrabudhe

Intel Corporation

Today the electronic world is becoming extremely dynamic with fast technological advances needing high performance, low power, high reliability and low cost. This poses a need for right synthesis of next gen technologies, future ecosystem and complete understanding of field/ use conditions. Intel widely uses Knowledge-based Reliability Assessment methodology to quality its products. This methodology relies on comprehensive understanding of the device usage that is stochastic in nature and complete characterization of physics of failure to perform realistic quality and reliability risk assessment. Hence, engineering mechanics and reliability statistics are two essential domains to perform such knowledge-based risk assessment. In this talk, the speaker will discuss the key elements of using mechanics modeling and reliability statistics that enables design feasibility assessment, design/process/material optimization and pro-active field failure assessment. An example of Packaging Solder Joint Reliability risk assessment will be presented.